MPC Series

MPC
Fiber To
The Chip

MPC 利用高反射金属光学镜面，可精确地塑造和引导光线进出 PIC（光子集成电路）。MPC 是一种通用解决方案，提供永久型和可拆卸型的边缘和表面耦合。MPC 采用专有的冲压工艺制造，为经济高效的大批量生产铺平了道路。

MPC Overview

效益大，占用空间小

MPC 利用高反射率的金属光学镜面，可以精确地塑造和引导光线，使其达到以下效果和 PIC（光子集成电路）。MPC 是一种通用解决方案，可提供 EDGE 和表面耦合器有永久型和可拆卸型两种。采用 MPC 采用专有的冲压工艺，为经济高效的大批量生产铺平了道路。制造。

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SEAT™ technology redefines PIC integration with a detachable solution purpose-built for Co-Packaged Optics (CPO). Developed by SENKO, the SEAT™ Cover Plate and SEAT™ Receptacle enable faster assembly, streamlined testing, and simplified PIC replacement. By decoupling the PIC during packaging and test, it reduces cost, shortens test cycles, and increases manufacturing flexibility. Highly repeatable alignment ensures precise positioning every time, eliminating a key bottleneck in scaling high-density CPO systems.

SEAT Overview

SEAT™ Technology Enables Co-Packaged Optics at Scale

Wafer-level photonics is transforming the future of optical networks, but only when testing and alignment can keep pace. By integrating SEAT™ and MPC with GlobalFoundries’ silicon photonics process, fine mechanical alignment, detachability, and repeatable optical coupling are possible from wafer-level testing through packaged photonic engines.

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让 PIC 耦合成为现实

MPC Series - Featured Content Detachability

可拆卸性

通过模块化积木式方法，实现经济高效的 CPO 交换机部署。

晶圆级测试

在生产过程中及早发现潜在故障

大批量生产

MPC 精密冲压工艺具有高度的可扩展性、可重复性和可转让性

Enabling the Photonics Ecosystem

Eric Snow, Fellow, Photonic Test Platforms at GlobalFoundries, discusses the shift of photonic integrated circuits from lab environments into high-volume manufacturing ecosystems. Detachable optical interfaces are emerging as an enabler across the Co-Packaged Optics (CPO) value chain, improving yield, manufacturability, and interoperability across the AI ecosystem.

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