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MPC - Tiny footprint

Big benefits, tiny footprint ​

The MPC leverages highly reflective metallic optical mirrors which shape and steer light precisely to and from the PIC (Photonic Integrated Circuit). The MPC is a universal solution providing EDGE and SURFACE coupling in both PERMANENT and DETACHABLE variants. Manufactured with a proprietary stamping process, the MPC paves the way for cost-efficient high-volume manufacturing.​

Making PIC Coupling Practical

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Commitment to Global Innovation

Kazu Takano, President of SENKO’s Emerging Technologies Group, shares insights into the company’s vision, its leadership in VSFF technology, and how SENKO continues to enable the future of AI infrastructure, co-packaged optics, and next-generation data center design.”

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The MPC is the smallest metallic PIC connector in the world. Its low profile, detachable design facilitates optimised space utilisation within congested CPO switch environments.

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