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Co-Packaged Optics
Integration of optics and electronics for high-speed, low-power data transmission in data centers.
Ventajas:
- Low-latency optical links between AI chips
- Scalable interconnect fabrics for AI clusters
- Ultra-high bandwidth
Optical Interconnects for AI
Designing optical interconnect solutions tailored for GPU/TPU clusters and AI accelerators.
Ventajas:
- Reduces latency and power in AI training fabrics
- Supports high-radix switching and optical mesh topologies
- Future-proofs AI infrastructure
Edge Optical Solutions
Developing compact, ruggedized optical components for edge computing, 5G, and IoT.
Ventajas:
- Supports low-latency, high-bandwidth edge applications
- Enables smart cities and autonomous vehicles
- Network scalability and flexibility
Co-Packaged Optics
Integration of optics and electronics for high-speed, low-power data transmission in data centers.
Ventajas:
- Low-latency optical links between AI chips
- Scalable interconnect fabrics for AI clusters
- Ultra-high bandwidth
Optical Interconnects for AI
Designing optical interconnect solutions tailored for GPU/TPU clusters and AI accelerators.
Ventajas:
- Reduces latency and power in AI training fabrics
- Supports high-radix switching and optical mesh topologies
- Future-proofs AI infrastructure
Edge Optical Solutions
Developing compact, ruggedized optical components for edge computing, 5G, and IoT.
Ventajas:
- Supports low-latency, high-bandwidth edge applications
- Enables smart cities and autonomous vehicles
- Network scalability and flexibility
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