Newsletter

SN-MT
2ch Uniboot

The perfect choice for rapid high density Data Center Inter-Connects ...

MPO und LC
EZ-Way

Connect 800G the EZ-Way with this fast, interoperable connectivity solution. ...

QPICPAC
MODUL

The MPC connector delivering optimized performance in the smallest footprint. ...

Treffen Sie
Dan Tsue

Find out more about Dan Tsue, our US-based VP of Sales...

ROBOTIC SWITCH
DENSIFICATION

Telescent leverage SENKO SN Connectivity to double robotic switch density. ...

From Pluggable Optics to CPO: The Shift in Thermal and Power Architecture

As AI and HPC systems scale, power consumption per bit is becoming a defining constraint. This artic...

Reducing Power Through On-board Optical Integration

On-board optics represent a key architectural step toward tighter optical integration. By shortening...

Von der Architektur bis zur Markteinführung: Die Zusammenarbeit im Ökosystem beschleunigt die Entwicklung von Co-Packaged-Optik

This showcase highlights how co-packaged optics is moving beyond concept into system-level deploymen...

The Real Barriers to Co-Packaged Optics: Yield, Reliability, and Serviceability Challenges

While CPO offers significant performance advantages, adoption requires overcoming challenges related...

CPO vs Pluggables: Performance, Power, and Scalability Benchmarking in the 800G–3.2T Era

How much efficiency can co-packaged optics deliver? This article compares traditional pluggable arc...

Enabling Scalable Co-Packaged Optics: The Critical Role of Optical Connectivity and Fiber Management

As optical engines move closer to the ASIC, connectivity becomes increasingly critical. Discover how...