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Lightmatter – Solving the Fiber-Attach Problem Holding CPO Back
Lightmatter’s vClick™ introduces detachable, vertical expanded‑beam connectivity to the PIC, designed for advanced packaging (including mold‑and‑grind) and “known‑good” optical engines before integration. Built with SENKO MPC + SEAT™ for high‑volume CPO.
Legrand – acclAIM: A Cassette-Free Path to Faster Fiber Deployments
Legrand’s acclAIM rethinks fiber architectures with a cassette‑free, direct‑mating design. See how SN connectivity and an acclAIM‑to‑SN adapter simplify installs, boost density, and speed time‑to‑deployment.
Panduit – Designing SAN Cabling for Gen7 Density
Panduit breaks down why Gen7 SAN density changes cabling priorities. Learn how dual SN on SFP‑DD and EZ‑FLIP polarity help teams scale port counts, simplify installs and MACs, and migrate from legacy duplex LC without a full rip‑and‑replace.
Marvell – Why Liquid-Cooled CPO is Reaching an Inflection Point
Marvell shares why liquid‑cooled co‑packaged optics are hitting an inflection point. From replacing copper with fiber to enabling higher speeds and tighter integration, see what’s accelerating real‑world CPO adoption.
Rosenberger – Making High‑Density Fiber Practical in Real Data Center Builds
Rosenberger explains how high‑density fiber designs must balance performance with real‑world handling. Learn how EZ‑Way usability across MPO, LC, and SN helps teams deploy faster, service tighter spaces, and scale fiber for future data center demands.
Missed OFC? Take a 3D Walk Through SENKO’s Booth
We’ve created an interactive 3D walkthrough of the SENKO booth, giving you the chance to experience our full presence from anywhere. As you move through the space, you’ll find videos that bring each display to life, with plenty of insights into our latest innovations and solutions.