SENKO and GlobalFoundries Achieve Breakthrough in Wafer-Level Detachable Fiber Interface and Optical Testing for Co-Packaged Optics

Copenhagen, Denmark – September 24th, 2025 – In a significant step forward for Co-Packaged Optics and high-volume PIC production, SENKO Advanced Components and GlobalFoundries today announced a detachable fiber connector solution that addresses the stringent demands of next generation of data centers while enabling a repeatable, precise method for testing the PICs at every stage of production. This new optical connectivity solution, built on the GF’s silicon photonics platform, enables broadband and high-radix to meet the growing demand for high-speed data transmission while improving the serviceability of CPO Switches for both scale-up and scale-out topologies.

This breakthrough begins with a photonic integrated circuit (PIC) with a uniquely engineered etched trench, developed by GF, that provides access to broadband light-in/light-out spot size converters (SSCs). In addition to enabling low-loss coupling, these SSCs are capable of withstanding the high-power lasers required by current co-packaged optics (CPO) solutions. Their scalability also supports the high radix counts demanded by modern systems.

Microlenses are precisely embedded within etched trenches using active alignment. Following verified optical performance, a SENKO SEAT receptacle is bonded directly to the die surface, establishing a mechanically robust and optically stable attachment point that enables repeatable, passive alignment during all subsequent stages of PIC assembly and packaging.

Thanks to the unique interlocking geometry integrated into the surface of the SEAT receptacle, any mating component with corresponding features can be precisely and passively aligned to the optical ports in the PIC. The mechanism provides repeatability, interchangeability, exceptional mechanical stability, and is fully optimized for high-volume manufacturing (HVM).

One such component is SENKO’s Metallic PIC Coupler (MPC), which mates with the receptacle to provide precise and repeatable optical coupling into the microlens. Its detachable form factor enables streamlined testing at the wafer and die level, while also supporting efficient integration during assembly. At the system level, the MPC functions as the critical optical interface between the PIC and the faceplate in high–data rate Co-Packaged Optics (CPO) switches, ensuring reliable connectivity and scalability for next-generation network architectures.

“This is a game-changer,” said Kazu Takano, Chief Business Development Officer and President of the SENKO Emerging Technologies Group. “This collaboration lays the foundation for a new era of Co-Packaged Optics. By enabling precise, repeatable alignment and seamless integration from wafer to system, we are opening the door to scalable manufacturing and unlocking the performance needed for the next generation of data infrastructure.”

GF’s comprehensive silicon photonics platform offers the efficiency, scalability and design flexibility to address both scale-up and scale-out networks. With high-volume manufacturing through its advanced fab in New York, GF provides the scale and ecosystem needed to deploy this alignment technology into mass production. Together, the companies are tackling one of the biggest hurdles for Co-Packaged Optics: achieving true manufacturing readiness.

“We are proud to partner with SENKO and deliver this breakthrough in PIC production on our silicon-proven silicon photonics platform that delivers the performance and bandwidth needed for next-generation AI datacenters,” said Kevin Soukup, senior vice president of GF’s silicon photonics product line. “With this latest advancement, we’ve taking a step forward to realizing co-packaged optics and unlocking the next era of connectivity.”

SENKO and GlobalFoundries will unveil the solution at ECOC 2025 in Copenhagen, where visitors to Booth C1431 can see the Fiber-to-the-Chip process, and explore its impact on real-world applications. Experts from both companies will be available for in-depth technical discussions.

“This is just the beginning,” added Takano. “As AI workloads and optical interconnects converge, this alignment breakthrough will serve as a foundational enabler, not only driving the adoption of Co-Packaged Optics, but shaping the future of global data infrastructure.”

Über SENKO Advanced Components

SENKO Advanced Components, Inc. is a wholly owned subsidiary of SENKO Advance Co., Ltd., headquartered in Yokkaichi, Japan. With 16 locations worldwide and extensive design and manufacturing capabilities, SENKO is recognized as a global leader in passive fiber optic interconnects and optical components. SENKO has deployed over 1 billion connectors, holds more than 500 patents, and continues to pioneer next-generation connectivity solutions for the Data Center, Telco, and Wireless markets.

Um Innovationen in neuen Anwendungen wie Co-Packaged Optics, optische Ausrichtungstechnologien und KI-fähige Verbindungen zu beschleunigen, hat SENKO die Emerging Technologies Group (ETG) gegründet, eine spezialisierte Abteilung, die sich auf die Entwicklung fortschrittlicher photonischer Lösungen für die Zukunft von Hochleistungsnetzwerken konzentriert.

Weitere Informationen finden Sie unter https://www.senko.com.

About GlobalFoundries (GF)

GlobalFoundries is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unyielding focus on security, longevity, and sustainability.

Weitere Informationen finden Sie unter www.gf.com