Aerotech, Santec, and SENKO Unveil Advanced Active Alignment Architecture for High-Volume Co-Packaged Optics

Camarillo, CA – January 13, 2026 – SENKO Advanced Components announces a groundbreaking collaboration with Aerotech and Santec to revolutionize active alignment for high-volume Co-Packaged Optics (CPO) production. Leveraging SENKO’s expertise in fiber optic interconnects, this partnership introduces the PICAlign™ architecture, a next-generation solution designed to overcome the speed, precision, and scalability challenges of CPO manufacturing

As data centers and AI computing systems accelerate toward higher bandwidth and greater power efficiency, CPO is emerging as the cornerstone of next-generation network infrastructure. However, scaling CPO introduces unprecedented challenges—particularly in aligning thousands of optical fibers to photonic integrated circuits (PICs) with nanometer precision across six degrees of freedom.

Traditional active alignment methods, optimized for faceplate pluggable transceivers, cannot keep pace with the complexity and scale of CPO modules. Expanded-beam optics, essential for detachable connectors, relax linear tolerances but impose strict angular alignment requirements. Each CPO module may require 100+ active alignment operations, making speed and accuracy critical for cost-effective manufacturing.

In response to these challenges, Aerotech, Santec and SENKO have developed the PICAlign™ architecture, a novel active alignment system that integrates high-speed motion control, synchronized data acquisition and sophisticated alignment algorithms.

This innovative solution, debuting at Photonics West 2026, performs precise, rapid active alignments of multichannel arrays in six degrees of freedom, enhancing the test and assembly processes for the next-generation of photonics and co-packaged optics technologies. The system integrates:

• Aerotech’s iXR3 Motion Controller for deterministic, high-speed 6-DOF positioning
• Santec’s OPM-200 Optical Power Meter and SLS-200 Stabilized Light Source for simultaneous multichannel optical power sampling
• Flexible alignment algorithms supporting custom objective functions and constrained optimization for complex channel configurations
• SENKO’s detachable PIC Coupler solution, enabling connector detachability and eliminating multiple optical alignments during the CPO packaging process

“We are excited to partner with SENKO and Santec to solve this critical challenge in CPO manufacturing,” said Brian O’Connor, Aerotech’s vice president of growth and strategy. “Our motion control technology ensures nanometer precision and high throughput, enabling alignment routines that were previously impossible at production scale.”

These innovations eliminate bottlenecks in the CPO supply chain, paving the way for scalable, cost-effective deployment of AI-ready optical networks. By combining detachable connector technology with intelligent alignment systems, Aerotech, Santec and SENKO are redefining the future of photonics manufacturing.

“Active alignment is the heartbeat of CPO manufacturing,” said Ryan Vallance, SENKO Advanced Components. “Our collaboration with Aerotech and Santec delivers a solution that meets the industry’s need for speed, precision and scalability.”

This architecture synchronizes high-frequency optical power sampling with high-resolution motion feedback, creating a real-time multidimensional dataset for rapid optimization. Leveraging serial kinematic mechanics, the system achieves superior dynamic response and nanometer-scale repeatability compared to traditional hexapod designs.

“By integrating multichannel optical feedback with synchronized motion control, we’ve created a system that optimizes every channel in real time—critical for high-power PM fibers and complex photonic devices,” said Chris Heisler, CEO of Santec California Corp.

Performance Highlights:

• Alignment to within ~0.2 dB of global optimum in < 1 second
• Multichannel monitoring across all device channels, not just outer loops
• Custom Objective Function for prioritizing PM fibers and critical channels
• Reliability exceeding 30,000 hours MTBF for continuous production

About Aerotech
Aerotech Inc. is the global industry leader in precision motion control and automation. From standard positioning technologies, control systems and optomechatronic solutions to custom-designed automation systems, our products support research and industrial organizations worldwide. Aerotech solutions enable manufacturing, testing and inspection processes on a micrometer and nanometer scale for the world’s best-known technology companies in industries such as semiconductors, consumer electronics and medical devices.

About Santec
Santec Holdings Corporation (the “Santec”) was established in 1979. It is headquartered in Komaki, Aichi, Japan and has subsidiaries in Japan (Santec AOC Corporation, Santec LIS Corporation, Santec OIS Corporation and Santec Japan Corporation), in North America (Santec Global Corporation in NJ, Santec U.S.A. Corporation in NJ, Santec Canada Corporation in Ottawa and Santec California Corporation in CA), U.K. (Santec Europe Ltd. in Oxfordshire) and China (Santec (Shanghai) Co., Ltd. in Shanghai). Santec is listed on the Standard Market (6777) a section of the Tokyo Stock Exchange. The company employs 293 staff members and serves a global customer base; including the world’s major telecommunications companies, transmission/sub system manufacturers, internationally recognized research centers and universities. Santec’s product lines include a broad range of advanced optical components, tunable lasers, optical test/measurement and OCT systems for telecommunication, life science, sensing and industrial applications.

Über SENKO Advanced Components
SENKO Advanced Components, Inc. ist eine hundertprozentige Tochtergesellschaft von SENKO Advance Co. mit Hauptsitz in Yokkaichi, Japan. Mit 16 Niederlassungen weltweit und umfangreichen Konstruktions- und Fertigungskapazitäten ist SENKO als globaler Marktführer für passive Glasfaserverbindungen und optische Komponenten anerkannt. SENKO hat mehr als 1 Milliarde Steckverbinder eingesetzt, hält mehr als 500 Patente und leistet weiterhin Pionierarbeit bei der Entwicklung von Verbindungslösungen der nächsten Generation für die Märkte Data Center, Telekommunikation und Wireless.

To accelerate innovation in emerging applications such as Co-Packaged Optics, optical alignment technologies, and AI-enabling interconnects, SENKO has established the Emerging Technologies Group (ETG), a specialized division focused on developing advanced photonic solutions that address the future of high-performance networking. For more information, visit https://www.senko.com.