SENKO and PHIX Advance European Photonics Packaging with a Serviceable Optical Interface for Multi-Chip Modules

MALAGA, Spain – September 17, 2026 – SENKO Advanced Components and PHIX Photonics Assembly today announced a collaborative solution framework that establishes a common optical interface for photonic multi-chip modules, supporting precision assembly, package-level testing, final system integration, and long-term serviceability. This collaboration positions PHIX as a European Centre of Excellence for manufacturing of detachable fiber connections to photonic modules.

As demand for AI infrastructure, high-performance computing, and co-packaged optics continues to grow, the industry faces a new challenge: scaling photonic manufacturing while maintaining the flexibility to test, validate, and service increasingly complex optical systems.

Combining PHIX’s advanced photonics packaging expertise with SENKO’s Micro Prism Array technology, SEAT™ receptacles, SAM-T (SENKO Alignment Master-Testing), and precision 6DoF alignment processes, the solution enables a repeatable optical interface that can be used throughout the product lifecycle.

Unlike traditional permanently attached optical interfaces, the architecture supports detachable fiber connectivity, creating greater flexibility during manufacturing while establishing a pathway toward future field serviceability. Optical components can be aligned during assembly, validated at the package level, verified at final system integration, and maintained using the same repeatable optical interface.

“The industry needs solutions that connect precision assembly, package-level testing, system integration, and long-term serviceability.” said Obie Roy, SENKO Advanced Components. “By working with PHIX, we are helping establish a common optical interface that supports the complete lifecycle of photonic multi-chip modules.”

The collaboration establishes PHIX as a European Centre of Excellence for detachable fiber assembly, which is one of the technologies that are becoming increasingly important for scaling AI, high-performance computing, and next-generation optical systems. By combining PHIX’s packaging expertise with SENKO’s precision optical connectivity technologies, the companies are helping establish manufacturing-ready approaches for photonic multi-chip modules.

Combined with SENKO’s SEAT Alignment Master (SAM series) platform, manufacturers can establish common optical references throughout the supply chain, improving consistency between packaging, testing, and final integration workflows.

“As optical engines move closer to the ASIC, the industry shouldn’t lose the operational flexibility that made pluggable optical transceivers so successful,” said Jeroen Duis, CTO of PHIX. “By combining advanced photonics packaging with a repeatable, detachable optical interface, this collaboration helps bridge the gap between CPO performance requirements and the practical needs of testing, maintenance, and long-term serviceability.”

By separating photonic packaging from permanent fiber attachment, the architecture enables future approaches to inspection, diagnostics, replacement, and maintenance without requiring a complete redesign of the optical assembly.

Visitors to ECOC 2026 can learn more about how SENKO Booth #1005 and PHIX Booth #1051 are enabling scalable photonic manufacturing through advanced packaging, precision optical alignment, package-level testing, and detachable optical connectivity.

 

Über SENKO

SENKO Advanced Components, Inc. ist eine hundertprozentige Tochtergesellschaft von SENKO Advance Co. mit Hauptsitz in Yokkaichi, Japan. Mit 16 Niederlassungen weltweit und umfangreichen Konstruktions- und Fertigungskapazitäten ist SENKO als globaler Marktführer für passive Glasfaserverbindungen und optische Komponenten anerkannt. SENKO hat mehr als 1 Milliarde Steckverbinder eingesetzt, hält mehr als 500 Patente und leistet weiterhin Pionierarbeit bei der Entwicklung von Verbindungslösungen der nächsten Generation für die Märkte Data Center, Telekommunikation und Wireless.

Um Innovationen in neuen Anwendungen wie Co-Packaged Optics, optische Ausrichtungstechnologien und KI-fähige Verbindungen zu beschleunigen, hat SENKO die Emerging Technologies Group (ETG) gegründet, eine spezialisierte Abteilung, die sich auf die Entwicklung fortschrittlicher photonischer Lösungen für die Zukunft von Hochleistungsnetzwerken konzentriert.

Weitere Informationen finden Sie unter https://www.senko.com

 

 

About PHIX

PHIX offers assembly services and contract manufacturing for devices based on photonic integrated circuits (PICs). We build optoelectronic modules based on all major PIC technology platforms, such as indium phosphide, silicon photonics, silicon nitride, and lithium niobate. We specialize in chip-to-chip hybrid integration, coupling to (lensed or spot size converting) fiber arrays, interfacing of DC and RF electrical signals, and integration with free space optics. By offering our knowledge already at the chip design stage, we help optimize performance, cost, time to market, and ease of scale-up towards volume manufacturing. PHIX provides a one-stop-shop for PIC assembly, from design to volume production.

With local production capabilities in Europe and the United States, PHIX is well positioned to support customers that require scalable, regionally anchored manufacturing and onshoring strategies for advanced photonic modules.

Weitere Informationen finden Sie unter https://www.phix.com