SENKO and PHIX Advance European Photonics Packaging with a Serviceable Optical Interface for Multi-Chip Modules

MALAGA, Spain – September 17, 2026 – SENKO Advanced Components and PHIX Photonics Assembly today announced a collaborative solution framework that establishes a common optical interface for photonic multi-chip modules, supporting precision assembly, package-level testing, final system integration, and long-term serviceability. This collaboration positions PHIX as a European Centre of Excellence for manufacturing of detachable fiber connections to photonic modules.

As demand for AI infrastructure, high-performance computing, and co-packaged optics continues to grow, the industry faces a new challenge: scaling photonic manufacturing while maintaining the flexibility to test, validate, and service increasingly complex optical systems.

Combining PHIX’s advanced photonics packaging expertise with SENKO’s Micro Prism Array technology, SEAT™ receptacles, SAM-T (SENKO Alignment Master-Testing), and precision 6DoF alignment processes, the solution enables a repeatable optical interface that can be used throughout the product lifecycle.

Unlike traditional permanently attached optical interfaces, the architecture supports detachable fiber connectivity, creating greater flexibility during manufacturing while establishing a pathway toward future field serviceability. Optical components can be aligned during assembly, validated at the package level, verified at final system integration, and maintained using the same repeatable optical interface.

“The industry needs solutions that connect precision assembly, package-level testing, system integration, and long-term serviceability.” said Obie Roy, SENKO Advanced Components. “By working with PHIX, we are helping establish a common optical interface that supports the complete lifecycle of photonic multi-chip modules.”

The collaboration establishes PHIX as a European Centre of Excellence for detachable fiber assembly, which is one of the technologies that are becoming increasingly important for scaling AI, high-performance computing, and next-generation optical systems. By combining PHIX’s packaging expertise with SENKO’s precision optical connectivity technologies, the companies are helping establish manufacturing-ready approaches for photonic multi-chip modules.

Combined with SENKO’s SEAT Alignment Master (SAM series) platform, manufacturers can establish common optical references throughout the supply chain, improving consistency between packaging, testing, and final integration workflows.

“As optical engines move closer to the ASIC, the industry shouldn’t lose the operational flexibility that made pluggable optical transceivers so successful,” said Jeroen Duis, CTO of PHIX. “By combining advanced photonics packaging with a repeatable, detachable optical interface, this collaboration helps bridge the gap between CPO performance requirements and the practical needs of testing, maintenance, and long-term serviceability.”

By separating photonic packaging from permanent fiber attachment, the architecture enables future approaches to inspection, diagnostics, replacement, and maintenance without requiring a complete redesign of the optical assembly.

Visitors to ECOC 2026 can learn more about how SENKO Booth #1005 and PHIX Booth #1051 are enabling scalable photonic manufacturing through advanced packaging, precision optical alignment, package-level testing, and detachable optical connectivity.

 

Acerca de SENKO

SENKO Advanced Components, Inc. es una filial propiedad al 100% de SENKO Advance Co., Ltd., con sede en Yokkaichi, Japón. Con 16 sedes en todo el mundo y amplias capacidades de diseño y fabricación, SENKO es reconocida como líder mundial en interconexiones pasivas de fibra óptica y componentes ópticos. SENKO ha desplegado más de 1.000 millones de conectores, posee más de 500 patentes y sigue siendo pionera en soluciones de conectividad de nueva generación para los mercados de centros de datos, telecomunicaciones e inalámbricos.

Para acelerar la innovación en aplicaciones emergentes como la óptica de empaquetado conjunto, las tecnologías de alineación óptica y las interconexiones habilitadoras de IA, SENKO ha creado el Grupo de Tecnologías Emergentes (ETG), una división especializada centrada en el desarrollo de soluciones fotónicas avanzadas que aborden el futuro de las redes de alto rendimiento.

Para más información, visite https://www.senko.com

 

 

About PHIX

PHIX offers assembly services and contract manufacturing for devices based on photonic integrated circuits (PICs). We build optoelectronic modules based on all major PIC technology platforms, such as indium phosphide, silicon photonics, silicon nitride, and lithium niobate. We specialize in chip-to-chip hybrid integration, coupling to (lensed or spot size converting) fiber arrays, interfacing of DC and RF electrical signals, and integration with free space optics. By offering our knowledge already at the chip design stage, we help optimize performance, cost, time to market, and ease of scale-up towards volume manufacturing. PHIX provides a one-stop-shop for PIC assembly, from design to volume production.

With local production capabilities in Europe and the United States, PHIX is well positioned to support customers that require scalable, regionally anchored manufacturing and onshoring strategies for advanced photonic modules.

Para más información, visite https://www.phix.com