Hudson, MA. — March 11, 2026 — SENKO Advanced Components, a global leader in fiber optic connectivity, today announced a breakthrough in detachable fiber connectivity for Co-Packaged Optics (CPO). The new Lightmatter vClick™ Optics architecture integrates SENKO’s detachable Metallic PIC Coupler (MPC) and SEAT™ optical interface, enabling high-bandwidth fiber array units (FAUs) designed for advanced packaging and high-volume production.

This innovation addresses one of the most significant challenges in scaling 3D co-packaged photonics, creating reliable, serviceable optical interfaces between fiber arrays and photonic integrated circuits (PICs) while maintaining the manufacturing yields required for hyperscale deployment.

Optimized for advanced semiconductor packaging flows, the detachable FAU solution enables known-good optical engines prior to final integration, significantly improving yield when combining photonics with high-value ASICs or AI accelerators.

Supporting Lightmatter’s Passage™ L-Series 3D photonic interconnect platform, the technology enables 32–100 Tbps+ optical connectivity while maintaining a demonstrated re-insertion loss of less than 1.5 dB, ensuring both high performance and field serviceability.

Scalable Photonic Interconnects for Advanced Packaging

The rapid evolution of AI infrastructure is driving the need for new optical interconnect architectures capable of supporting unprecedented bandwidth densities. However, integrating optical engines into advanced packaging environments presents significant manufacturing challenges.

Through the combination of Lightmatter’s vertical expanded beam architecture and SENKO’s detachable MPC connector technology, the solution enables a plug-and-play optical interface compatible with advanced packaging assembly flows.

By enabling detachable fiber connectivity earlier in the fabrication process, manufacturers can validate optical performance before final packaging—reducing yield loss and accelerating production scaling.

“The increasing complexity in advanced AI chip packages and their production processes necessitates a move toward a known good optical engine at the wafer level,” said Ritesh Jain, SVP, Engineering and Operations, Lightmatter. “With vClick, we are providing physical optical engine connectivity that integrates seamlessly into the world’s largest and most advanced semiconductor supply chains, ensuring that our L-Series 3D CPO platform is hyperscale volume-ready.”

Key Advantages of Lightmatter vClick Optics:

• High‑Bandwidth Optical Connectivity
  Supports broadband CWDM and DWDM operation across more than 80 nm of spectrum, enabling massive bandwidth density and system flexibility.
• Advanced Packaging Compatibility
  Designed for mold‑and‑grind semiconductor packaging flows used by leading foundries and outsourced semiconductor assembly and test (OSAT) providers.
• Automated Assembly
  The passive expanded‑beam interface eliminates the need for active fiber alignment, reducing assembly complexity and production time.
• Field‑Serviceable Detachable FAUs
  Leveraging SENKO’s SEAT® and MPC® technologies, vClick Optics demonstrates insertion and re‑insertion loss below 1.5 dB, preserving optical power for field‑serviceable CPO systems exceeding 100 Tbps.

“Our partnership with Lightmatter on vClick Optics moves detachable fiber connectors closer to mainstream adoption,” said Kazu Takano, President, Senko Emerging Technologies Group and Corporate Officer at SENKO Advanced Components. “By integrating our SEATTM and MPC technologies into Lightmatter’s 3D CPO architecture, we are enabling detachable fiber interfaces that meet the manufacturability, performance, and serviceability requirements of large-scale AI infrastructure.”

An FAU serves as the critical bridge between optical fibers and Photonic Integrated Circuits (PICs). vClick Optics represents a major step forward as the industry’s first detachable FAU that is compatible with advanced packaging, transforming once-permanent fiber attachment into a “must-have” plug-and-play FAU. With this new technology, Lightmatter ensures that high-density 3D CPO solutions like Passage L-Series are both massively deployable and easily serviceable for mission-critical hyperscale AI data center applications.

Lightmatter, Passage, and vClick are trademarks of Lightmatter, Inc.

Sobre a SENKO Advanced Components
A SENKO Advanced Components, Inc. é uma subsidiária integral da SENKO Advance Co., Ltd. com sede em Yokkaichi, Japão. Com 16 localidades em todo o mundo e amplas capacidades de projeto e fabricação, a SENKO é reconhecida como líder global em interconexões de fibra óptica passiva e componentes ópticos. A SENKO implantou mais de 1 bilhão de conectores, detém mais de 500 patentes e continua a ser pioneira em soluções de conectividade de próxima geração para os mercados de Data Center, Telecomunicações e Sem Fio.

To accelerate innovation in emerging applications such as Co-Packaged Optics, optical alignment technologies, and AI-enabling interconnects, SENKO has established the Emerging Technologies Group (ETG), a specialized division focused on developing advanced photonic solutions that address the future of high-performance networking. For more information, visit https://www.senko.com.