SN-MT: O facilitador do ELSFP em placas frontais de alta densidade

In modern networking systems, the demand for higher bandwidth and greater port density continues to rise, driven by the proliferation of data-intensive applications such as AI workloads, 5G networks, and hyperscale cloud computing. Meeting these demands requires innovative approaches to optical interconnect design.

One such innovation is the combination of SENKO’s Very Small Form Factor (VSFF) multi-fiber connector, SN-MT, and the External Laser Small Form-Factor Pluggable (ELSFP) module. This pairing enables high-density faceplates while improving thermal performance and serviceability for next-generation optical systems.

Understanding SN-MT

SN-MT is SENKO’s advanced VSFF multi-fiber connector designed to facilitate high-density optical connectivity. Compared to traditional MPO connectors, SN-MT offers a smaller physical footprint and simplified polarity and keying management. It supports multi-fiber configurations while maintaining low insertion loss and excellent optical performance.

The compact SN-MT design:

• Reduces faceplate footprint, enabling more ports per RU.

• Supports higher density in data center and telecom equipment.
• Maintains high optical performance, even in densely packed environments.

This is especially valuable in space-constrained environments such as CPO (Co-Packaged Optics) switches and next-gen faceplate designs where every millimeter counts.

What is ELSFP?

ELSFP modules are pluggable external laser sources, developed under the Optical Internetworking Forum’s (OIF) implementation agreement, they supply continuous-wave (CW) laser light to optical engines or co-packaged optics (CPO) modules located elsewhere in the system.

By relocating the laser source from the optical engine to the faceplate:

• Thermal load is reduced in the high-heat ASIC/engine area.
• Serviceability is improved (lasers can be hot-swapped without disturbing the switch or optical engine).
• Reliability is enhanced by keeping the laser in a more temperature-controlled zone.

The ELSFP blind-mate optical interface ensures eye-safe operation and robust connectivity, delivering laser light into the optical engine through fiber jumpers.

How SN-MT and ELSFP Work Together

Designing high-density faceplates for networking equipment comes with several challenges:

• Maximizing port density in a confined area.
• Managing heat from high-power optical and ASIC components.
• Maintaining low insertion loss and high reliability at scale.

The combination of SN-MT and ELSFP addresses all three:

• SN-MT enables more ELSFP ports per faceplate by reducing connector size and improving fiber management.
• ELSFP shifts the heat-generating laser out of the optical engine, helping maintain temperature stability and laser wavelength accuracy.
• Together, they maximize port density, improve thermal performance, and simplify field maintenance

For example, SN-MT’s compact ferrule design allows more fibers in the same space compared to MPO, enabling denser ELSFP deployment on the faceplate. This results in higher aggregate bandwidth without requiring larger chassis sizes.

The image below compares the space needed to accommodate the application of ELSFP with MPO connectors and with SN-MT connectors.

Cost Per-Bit Advantage

By combining High port density (SN-MT) with Externalized laser sources (ELSFP), you lower the overall cost per bit in several ways:

• Reduced need for complex thermal management inside the switch.
• Lower energy consumption per optical lane.
• More efficient use of rack space, delaying costly infrastructure expansion.

Conclusão

As networking requirements evolve toward co-packaged optics and ever-higher densities, the combination of SN-MT and ELSFP is a key enabler.

SN-MT delivers the compact, high-performance fiber interface needed for dense faceplates, while ELSFP modules provide reliable, field-replaceable laser sources that keep heat away from sensitive optical engines.

This pairing allows network designers to scale capacity, improve thermal and maintenance performance, and prepare for future demands without compromising reliability.