viaPhoton Chooses LC EZ-Way for Industry-Leading Density

As AI infrastructure continues to scale, data center operators are under pressure to deliver extreme fiber density within increasingly constrained rack space. High-performance optical architectures must support rapid deployment, easy serviceability, and long-term reliability without adding operational complexity or driving up labor costs. For solution providers like viaPhoton, achieving this balance is critical when designing next-generation high-density fiber panels for AI-driven environments.

AI and HPC data centers require extreme port density.

AI and high-performance computing data centers demand massive port density in minimal space.Traditional connectors fall short, limiting access in ultra-dense panels, slowing installs and maintenance, increasing error risk during MACs, and driving up labor and deployment time.

The Solution: LC EZ-Way Connectivity

viaPhoton’s HyperReach™ solution, the densest offering on the market today, leverages SENKO’s LC EZ-Way® connector to overcome these challenges. LC EZ-Way’s innovative push-pull boot design enables intuitive access in tightly packed environments while maintaining secure, high-performance optical connections.

Key capabilities include:

• Support for up to 192 LC connections in a single 1U panel
• Tool-free installation and removal, enabling faster deployment and on-site hot swapping
• EZ-Way polarity reversing, allowing quick and easy polarity changes in QSFP-dense applications without disrupting adjacent connections

This combination of density, usability, and flexibility allows viaPhoton to deliver a solution optimized for both performance and operational efficiency.

Density and Speed for AI-Scale Deployments

By integrating SENKO’s LC EZ-Way connector, viaPhoton enables data center operators to maximize rack utilization, streamline installations, and maintain confidence in high-density optical environments. As AI-driven data centers continue to push density limits, LC EZ-Way provides a proven path to faster deployment, easier serviceability, and scalable performance.

Saiba mais sobre SENKO LC EZ-Way solutions and how they enable next-generation high-density fiber architectures.

About viaPhoton

viaPhoton is a US-based AI factory fiber connectivity provider that is changing the norm by delivering customer-first, technology-led solutions. We engineer at speed and execute at scale, increasing the speed of usable compute while future-proofing your data center architecture.

Website: www.viaPhoton.com
LinkedIn: https://www.linkedin.com/company/viaphoton
Contact Info: sales@viaPhoton.com