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Events
ECOC 2026: From Faster Optics to Smarter Architectures
ECOC 2026 showed that scaling AI infrastructure is about more than faster optics. Explore how 1.6T and 3.2T, NPO, CPO...
Scaling AI Takes More Than One Company
AI connectivity is moving too quickly for any one company to solve every challenge alone. SENKO's Phil Ward explains why...
PICALIGN™: Active Alignment Ready for Production
Active alignment remains a bottleneck for scaling photonics. Aerotech’s Justin Bressi demonstrates how PICALIGN™ delivers precise optical alignment in seconds...
From Photonic Innovation to Volume Manufacturing
Innovation in integrated photonics is moving fast, but manufacturing must keep pace. PHIX CTO Jeroen Duis discusses the challenge of...
Scaling Silicon Photonics: Solving the Test Challenge
As silicon photonics moves toward volume manufacturing, testing becomes a critical challenge. Advantest's Natsuki Shiota explains how SENKO, Advantest and...
From Architecture to Adoption: Ecosystem Collaboration Accelerates Co-Packaged Optics
This showcase highlights how co-packaged optics is moving beyond concept into system-level deployment, with ecosystem partners demonstrating integration across AI...
Lightmatter – Solving the Fiber-Attach Problem Holding CPO Back
Lightmatter’s vClick™ introduces detachable, vertical expanded‑beam connectivity to the PIC, designed for advanced packaging (including mold‑and‑grind) and “known‑good” optical engines...
Legrand – acclAIM: A Cassette-Free Path to Faster Fiber Deployments
Legrand’s acclAIM rethinks fiber architectures with a cassette‑free, direct‑mating design. See how SN connectivity and an acclAIM‑to‑SN adapter simplify...
Panduit – Designing SAN Cabling for Gen7 Density
Panduit breaks down why Gen7 SAN density changes cabling priorities. Learn how dual SN on SFP‑DD and EZ‑FLIP polarity help...
Marvell – Why Liquid-Cooled CPO is Reaching an Inflection Point
Marvell shares why liquid‑cooled co‑packaged optics are hitting an inflection point. From replacing copper with fiber to enabling higher speeds...
Rosenberger – Making High‑Density Fiber Practical in Real Data Center Builds
Rosenberger explains how high‑density fiber designs must balance performance with real‑world handling. Learn how EZ‑Way usability across MPO, LC, and...
Missed OFC? Take a 3D Walk Through SENKO’s Booth
We’ve created an interactive 3D walkthrough of the SENKO booth, giving you the chance to experience our full presence from...