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Connecting the Industry Behind AI: SENKO at FiberConnect APAC 2026

The future of artificial intelligence depends on the infrastructure we build, and on how effectively...

OCP 2026 Optical Backplanes Reshape the Architecture of AI Infrastructure

OCP 2026 brought a more demanding question into focus for optical interconnection: how does bandwidt...

ECOC 2026: From Faster Optics to Smarter Architectures

One week after ECOC 2026, the industry’s direction is becoming clear: scaling AI infrastructure is...

CIOE 2026

CIOE 2026 highlighted a broader challenge for AI infrastructure: delivering higher bandwidth require...

From 400G to 1.6T: The Infrastructure Challenge Behind Next-Generation Networks

As networks evolve toward 1.6T speeds, increasing density, breakout requirements, and cabling comple...

viaPhoton Chooses LC EZ-Way for Industry-Leading Density

High‑count builds are hard to service. viaPhoton HyperReach uses LC EZ‑Way™ to keep access eas...

Optimizing High-Density Connectivity with SENKO’s EZ-WAY™ Series Connectors

Explore the engineering behind SENKO’s EZ-WAY™ Series connectors—why staying inside the transc...

How to Select the Right Transceiver for Your Network

Selecting the right transceiver impacts performance, scalability, and long‑term network design. Th...

SN-MT: The Enabler of ELSFP in High Density Faceplate

SN‑MT and ELSFP reshape high‑density faceplates, more ports, less heat, easier upgrades. Lasers ...

The Evolution of Data Transmission: Why Fiber is Replacing Copper at the Chip Level

In the digital age, the demand for faster and more efficient data transmission is relentless. ...

Choosing Between a Base-8 or a Base-12 Cabling System

Base-8 and Base-12 fiber optic cabling systems differ primarily in their design, scalability, and ef...

SENKO’s SN and SN-MT Connector Assembly: Revolutionizing Trunk Cable Deployment in Data Centers

Data centers are the backbone of modern digital infrastructure, driving the ever-growing demands of ...