MPC Series

MPC
Fiber To
The Chip

The MPC leverages highly reflective metallic optical mirrors which shape and steer light precisely to and from the PIC (Photonic Integrated Circuit). The MPC is a universal solution providing EDGE and SURFACE coupling in both PERMANENT and DETACHABLE variants. Manufactured with a proprietary stamping process, the MPC paves the way for cost-efficient high-volume manufacturing.

MPC Overview

Big benefits, tiny footprint

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SEAT™ technology redefines PIC integration with a detachable solution purpose-built for Co-Packaged Optics (CPO). Developed by SENKO, the SEAT™ Cover Plate and SEAT™ Receptacle enable faster assembly, streamlined testing, and simplified PIC replacement. By decoupling the PIC during packaging and test, it reduces cost, shortens test cycles, and increases manufacturing flexibility. Highly repeatable alignment ensures precise positioning every time, eliminating a key bottleneck in scaling high-density CPO systems.

SEAT Overview

SEAT™ Technology Enables Co-Packaged Optics at Scale

Wafer-level photonics is transforming the future of optical networks, but only when testing and alignment can keep pace. By integrating SEAT™ and MPC with GlobalFoundries’ silicon photonics process, fine mechanical alignment, detachability, and repeatable optical coupling are possible from wafer-level testing through packaged photonic engines.

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Making PIC Coupling Practical

Detachability

Enables cost-effective CPO switch deployments with a modular building block approach.

Wafer Level Testing

Identifies potential failures early in the manufacturing process

High Volume Manufacturing

The MPC Precision stamping process is highly scalable, repeatable and transferable

Enabling the Photonics Ecosystem

Eric Snow, Fellow, Photonic Test Platforms at GlobalFoundries, discusses the shift of photonic integrated circuits from lab environments into high-volume manufacturing ecosystems. Detachable optical interfaces are emerging as an enabler across the Co-Packaged Optics (CPO) value chain, improving yield, manufacturability, and interoperability across the AI ecosystem.

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The MPC is the smallest metallic PIC connector in the world. Its low profile, detachable design facilitates optimised space utilisation within congested CPO switch environments.

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