Blog post
SN-MT: The Enabler of ELSFP in High Density Faceplate
SN‑MT and ELSFP reshape high‑density faceplates, more ports, less heat, easier upgrades. Lasers move to the edge, fiber gets compact,...
Advantages of Using SENKO’s SN-MT for Data Center Cabling
SN-MT is making waves in the data center world. Here’s why you’ll want it in your setup
SENKO’s Grade-Q Connectors
Quantum computers are anticipated to solve mathematical problems that conventional computers which use binary digits cannot address.
Surface and Edge Coupling: Versatility of the MPC Connector
Photonics integration necessitates precise light coupling methods to optimize efficiency in Photonic Integrated Circuit (PIC) applications. Two primary coupling techniques,...
MPC Main Applications: Enabling Next-Generation Optical Connectivity
The Metallic PIC Connector (MPC) is an essential component in next-generation optical and photonic interconnects, facilitating high-density, high-speed data transmission...
MPC Miniature Footprint: High-Density Optical Connectivity in a Compact Design
s optical networks necessitate increased density and modular scalability, the Metallic PIC Connector (MPC) provides an ultra-compact footprint specifically designed...
Metallic PIC Connector
The Metallic PIC Connector (MPC) is an advanced optical interconnect designed for Photonic Integrated Circuits (PICs) and Co-Packaged Optics (CPO).
High-Precision Metal Stamping Technology in SENKO’s MPC Connector
In the realm of advanced optical connectivity, SENKO’s MPC (Metallic Precision Connector) stands out as a cutting-edge solution leveraging high-precision...
Energy Efficiency in Co-Packaged Optics
As data rates continue to surge past 800G and into multi-terabit speeds, energy efficiency is becoming a critical concern for...
Timeline of Advancements in the Transition to Co-Packaged Optics
The journey toward Co-Packaged Optics (CPO) began with the widespread adoption of pluggable optical transceivers for lower-speed applications. In the...
The Evolution of Fiber Connectivity: From Pluggable Optics to Co-Packaged Optics (CPO)
As data centers and high-performance computing environments push the boundaries of network speeds, traditional pluggable transceivers are reaching their physical...
The Rise of Co-Packaged Optics (CPO): Revolutionizing High-Speed Connectivity
The explosive growth of Artificial Intelligence (AI), High-Performance Computing (HPC), Machine Learning (ML), and Hyperscale Data Centres is pushing the...








