Blog post
Advantages of Using SENKO’s SN-MT for Data Center Cabling
SN-MT is making waves in the data center world. Here’s why you’ll want it in your setup
SENKO’s Grade-Q Connectors
Quantum computers are anticipated to solve mathematical problems that conventional computers which use binary digits cannot address.
Surface and Edge Coupling: Versatility of the MPC Connector
Photonics integration necessitates precise light coupling methods to optimize efficiency in Photonic Integrated Circuit (PIC) applications. Two primary coupling techniques,...
MPC Main Applications: Enabling Next-Generation Optical Connectivity
The Metallic PIC Connector (MPC) is an essential component in next-generation optical and photonic interconnects, facilitating high-density, high-speed data transmission...
MPC Miniature Footprint: High-Density Optical Connectivity in a Compact Design
s optical networks necessitate increased density and modular scalability, the Metallic PIC Connector (MPC) provides an ultra-compact footprint specifically designed...
Metallic PIC Connector
The Metallic PIC Connector (MPC) is an advanced optical interconnect designed for Photonic Integrated Circuits (PICs) and Co-Packaged Optics (CPO).
High-Precision Metal Stamping Technology in SENKO’s MPC Connector
In the realm of advanced optical connectivity, SENKO’s MPC (Metallic Precision Connector) stands out as a cutting-edge solution leveraging high-precision...
Energy Efficiency in Co-Packaged Optics
As data rates continue to surge past 800G and into multi-terabit speeds, energy efficiency is becoming a critical concern for...
Timeline of Advancements in the Transition to Co-Packaged Optics
The journey toward Co-Packaged Optics (CPO) began with the widespread adoption of pluggable optical transceivers for lower-speed applications. In the...
The Evolution of Fiber Connectivity: From Pluggable Optics to Co-Packaged Optics (CPO)
As data centers and high-performance computing environments push the boundaries of network speeds, traditional pluggable transceivers are reaching their physical...
The Rise of Co-Packaged Optics (CPO): Revolutionizing High-Speed Connectivity
The explosive growth of Artificial Intelligence (AI), High-Performance Computing (HPC), Machine Learning (ML), and Hyperscale Data Centres is pushing the...
SENKO’s Total Integrated Solution for Next-Generation Transceivers
As network demands continue to grow, the development of next-generation transceivers capable of supporting 1.6Tbps and beyond has become essential.