Newsletter
New Product
Micro LC Connector
Compact, high-density connector for behind-the-wall applications!
New Product
MPO Plus Micro Latch
Compact, high-density connector for behind-the-wall applications!
Employee Spotlight
Tanay Larence Employee Spotlight
Meet Tanay Larence, Associate Mechanical Design Engineer
Employee Spotlight
Jim Hasegawa Employee Spotlight
Find out more about Jim Hasegawa, President of the OC Division
High Density
Manage Bend-radius in Cables
Protect Your Fiber Optic Network: Critical Considerations for Bend-radius and Strain-relief
New Product
On-Board Interconnect Solutions Page
High-performance, reliable on-board connectros for demanding applications.
Tech Blog
SENKO at COP29: Sustainability for AI Data Centers
At COP29, held in Azerbaijan, SENKO proudly joined global leaders in addressing climate change and advancing sustainability.
Blog post
Maximizing Patch Panel Densification with SENKO’s VSFF
In today’s high-density data centers and telecom infrastructures, space efficiency is more critical than ever. As technology evolves, so does...