Tech Blog

Optimizing High-Density Connectivity with SENKO’s EZ-WAY™ Series Connectors

Explore the engineering behind SENKO’s EZ-WAY™ Series connectors—why staying inside the transc...

SENKO’s Grade-Q Connectors

Quantum computers are anticipated to solve mathematical problems that conventional computers which u...

Surface and Edge Coupling: Versatility of the MPC Connector

Photonics integration necessitates precise light coupling methods to optimize efficiency in Photonic...

MPC Main Applications: Enabling Next-Generation Optical Connectivity

The Metallic PIC Connector (MPC) is an essential component in next-generation optical and photonic i...

MPC Miniature Footprint: High-Density Optical Connectivity in a Compact Design

s optical networks necessitate increased density and modular scalability, the Metallic PIC Connector...

Metallic PIC Connector

The Metallic PIC Connector (MPC) is an advanced optical interconnect designed for Photonic Integrate...

High-Precision Metal Stamping Technology in SENKO’s MPC Connector

In the realm of advanced optical connectivity, SENKO’s MPC (Metallic Precision Connector) stands o...

Energy Efficiency in Co-Packaged Optics

As data rates continue to surge past 800G and into multi-terabit speeds, energy efficiency is becomi...

Timeline of Advancements in the Transition to Co-Packaged Optics

The journey toward Co-Packaged Optics (CPO) began with the widespread adoption of pluggable optical ...

The Evolution of Fiber Connectivity: From Pluggable Optics to Co-Packaged Optics (CPO)

As data centers and high-performance computing environments push the boundaries of network speeds, t...

The Rise of Co-Packaged Optics (CPO): Revolutionizing High-Speed Connectivity

The explosive growth of Artificial Intelligence (AI), High-Performance Computing (HPC), Machine Lear...

SENKO’s Total Integrated Solution for Next-Generation Transceivers

As network demands continue to grow, the development of next-generation transceivers capable of supp...