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Why Engineers are Switching to the EZ‑Way
High‑density racks are hard to service. This animation shows how LC EZ‑Way™ improves access with a footprint‑friendly design, push‑pull boot, and tool‑free polarity, speeding MACs and reducing handling errors in tight AI and cloud environments.
Access in Tight Spaces, Solved
Dense racks leave no room to grip. LC EZ‑Way™ fits within the transceiver footprint and adds a push‑pull boot for quick removal. Tool‑free polarity speeds turn‑ups & fixes, cutting MAC time and errors for AI, cloud and enterprise builds.
LC EZ-Way Powers viaPhoton’s High-Density Solution
High‑count builds are hard to service. viaPhoton HyperReach uses LC EZ‑Way™ to keep access easy with a push‑pull boot and tool‑free polarity. Pack up to 192 LCs in 1U while speeding turn‑ups and MACs, deploy faster without compromise.
SN EZ-Flip
The SN EZ-Flip from SENKO is the densest duplex connector in the world. With carrier-grade performance and reliability, swapping the polarity on the SN EZ-Flip is seamless. Without removing ferrules or exposing fibers, the SN EZ-Flip enables seamless polarity change.
Spotlight: Phil Ward
Meet Phil Ward, Director of Strategic Marketing. He bridges strategy and storytelling, turning complex tech into clear, human narratives. Watch the spotlight and discover the vision behind SENKO’s growth.
Enabling Gen 7 SAN Performance with SN® Connectivity
Panduit’s Gen7 SAN Directors boost performance and port density—but cabling is critical. With SENKO SN® connectivity built into Panduit architectures, customers get cleaner ports, easier MACs, and scalable 400G/800G designs for future-ready data centers.