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MPC Miniature Footprint: High-Density Optical Connectivity in a Compact Design

s optical networks necessitate increased density and modular scalability, the Metallic PIC Connector...

Form Error for Individual Stamped Mirrors and Arrays: Precision Optical Manufacturing

Ensuring high-precision optical surfaces is essential for beam steering, photonic integration, and f...

Assessment of Surface Finish on Stamped Mirrors of Metallic PIC Connectors (MPC)

The development of high-performance photonic integrated circuits (PICs) has driven the need for adva...

Metallic PIC Connector

The Metallic PIC Connector (MPC) is an advanced optical interconnect designed for Photonic Integrate...

High-Volume Manufacturing with SENKO’s Metallic PIC Connector (MPC)

In the ever-evolving world of optical and photonic applications, precision, scalability, and cost-ef...

High-Precision Metal Stamping Technology in SENKO’s MPC Connector

In the realm of advanced optical connectivity, SENKO’s MPC (Metallic Precision Connector) stands o...

Overcoming the Challenges of Photonic Integrated Circuit (PIC) Connectivity with SENKO’s Metallic PIC Connector (MPC)

Photonic Integrated Circuits (PICs) are at the forefront of next-generation optical communication, d...

The Silicon Photonics Connectivity Ecosystem and SENKO’s Role

Silicon photonics is revolutionizing data communication, high-performance computing, and next-genera...

Energy Efficiency in Co-Packaged Optics

As data rates continue to surge past 800G and into multi-terabit speeds, energy efficiency is becomi...

Timeline of Advancements in the Transition to Co-Packaged Optics

The journey toward Co-Packaged Optics (CPO) began with the widespread adoption of pluggable optical ...

The Evolution of Fiber Connectivity: From Pluggable Optics to Co-Packaged Optics (CPO)

As data centers and high-performance computing environments push the boundaries of network speeds, t...

The Rise of Co-Packaged Optics (CPO): Revolutionizing High-Speed Connectivity

The explosive growth of Artificial Intelligence (AI), High-Performance Computing (HPC), Machine Lear...